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Phenylsuccinic Acid

Identification

Synonyms: dl-Phenylsuccinic acid; Phenyl butanedioic acid; (+/-)-Phenylsuccinic acid; PSA; Phenyl Succinic Acid
CAS No.: 635-51-8
EINECS No.: 211-238-1

China Customs Code:

HS code:
Molecular Weight: 194.18
Molecular Formula: C10H10O4
Structural Formula: phenylsuccinic acid
Melting Point: 166-168 °C (lit.)
Boiling Point: 308 °C at 760 mmHg

Flashing point: 154 °C

Water solubility: soluble in methanol, ethanol, IPA, ether, ketone; Insoluble in benzene, CCl4.

Application

Phenylsuccinc acid is mainly used as an acid activator for solder flux in electronic industry. Other applications includes chemical reagent and pharmaceutical synthesis. Coordinated with adipic acid and some surfactant and adjuvent, phenylsuccinic acid can increase solder paste's solderability. Function of organic acids in solder flux is to remove metal oxides during Surface Mount Technology (SMT) process.

Specification*

Phenyl Succinic acid 99.0% min.
m.p. (°C) 166 to 168
moisture 0.5% max.
residue on ignition 0.1% max.
appearance white crystal powder

 

Standard Packaging

25kgs/fiber drum, on pallets.

Packaging photo coming soon

Risks and Safety Information

Phenylsuccinic Acid is not regulated by UN. Safe for air, land and sea transportation

Risk Phrase: R36/37/38

Safety Phrase: S22, S34/25, S26, S37/39

Warning: Irritant

caution

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